Cable Types: MCA7K20-X001 / O4O224-1.6T-AC1H

Brand: NVIDIA/Mellanox (InfiniBand)

Cable : 1m (3ft) / 1.5m (5ft) / 2m (7ft) / 2.5m (8.2ft) NVIDIA/Mellanox MCA7K20-X001 (980-9IAQ5-00X001) Compatible 1.6T ACC OSFP224 IHS/Closed Finned Top 8x200G PAM4 to 4x400G OSFP224 RHS/Flat Top 2x200G PAM4 InfiniBand XDR Active Copper Splitter Cable for NVIDIA Quantum-X800 Switches to 4x400G ConnectX-8 / ConnectX-9 OSFP NICs and NVIDIA DGX B300 / GB300 GPU Clusters

The NVIDIA/Mellanox MCA7K20-X001 (980-9IAQ5-00X001) Compatible 1.6T ACC OSFP224 Active Copper Splitter Cable is an advanced, high-density 1.6T-to-4x400G breakout solution designed for next-generation InfiniBand XDR networks and ultra-high-speed AI data center deployments. Utilizing 8x200Gb/s PAM4 electrical modulation, this Active Copper Cable (ACC) splits a single 1.6Tb/s twin-port OSFP224 host connection into four independent 400Gb/s (2x200G PAM4) OSFP224 endpoints, providing flexible, high-bandwidth interconnectivity across short distances.

100% verified on original hardware, the MCA7K20-X001 features an Integrated Heat Sink (IHS / Closed Finned Top) connector profile on the 1.6T switch side and four Riding Heat Sink (RHS / Flat Top) connectors on the breakout end. It is purpose-built to connect 1.6T switches—such as the NVIDIA Quantum-X800 series—directly to four 400G network interfaces, including NVIDIA ConnectX-8 and ConnectX-9 OSFP NICs. Compared to passive DACs, active copper architecture provides superior signal integrity and flexibility across lengths up to 2.5m with low power consumption (2.5W max), making it ideal for NVIDIA DGX B300 and GB300 GPU clusters.

Key Features

• 100% Verified Compatibility: Fully compatible with NVIDIA/Mellanox MCA7K20-X001 (980-9IAQ5-00X001) for seamless deployment in Quantum-X800 InfiniBand XDR architectures.
• 1.6T to 4x400G ACC Breakout Architecture: Converts a 1.6Tb/s (8x200G PAM4) twin-port OSFP224 interface into four 400Gb/s (2x200G PAM4) OSFP224 interfaces to optimize switch port utilization.
• Optimized for Next-Gen AI Clusters: Purpose-built for deployment in high-density NVIDIA DGX B300 and GB300 GPU cluster environments.
• Active Copper Performance: Ensures ultra-low insertion loss, extreme crosstalk & EMI resistance, and improved signal reach over passive DACs while keeping power consumption low at ≤2.5W.
• Hybrid IHS to RHS Thermal Design: Utilizes a Closed Finned Top (IHS) profile on the switch side for air-cooled chassis and Flat Top (RHS) profiles on the NIC side for tight server enclosure clearances.
• LSZH Jacket Material: Built with Low Smoke Zero Halogen (LSZH) jacket materials for superior safety and compliance in modern data centers.

Technical Specifications