Cable Types: MCA7K10-X001 / O2O224-1.6T-AC1H

Brand: NVIDIA/Mellanox (InfiniBand)

Cable : 1m (3ft) / 1.5m (5ft) / 2m (7ft) / 2.5m (8.2ft) NVIDIA/Mellanox MCA7K10-X001 (980-9IAO5-00X001) Compatible 1.6T ACC OSFP224 IHS/Closed Finned Top 8x200G PAM4 to 2x800G OSFP224 RHS/Flat Top 4x200G PAM4 InfiniBand XDR Active Copper Splitter Cable for Quantum-X800 Q3400-RA Switch to 2x800G ConnectX-8/9 OSFP SuperNICs (C8180 / C9180) and NVIDIA DGX B300 / GB300 Clusters

The NVIDIA/Mellanox MCA7K10-X001 (980-9IAO5-00X001) Compatible 1.6T ACC OSFP224 Active Copper Splitter Cable is an advanced, high-density breakout solution engineered for next-generation InfiniBand XDR architectures and ultra-high-speed AI data centers. Built on 8x200Gb/s PAM4 electrical modulation, this Active Copper Cable (ACC) splits a single 1.6Tb/s twin-port OSFP224 host connection into two independent 800Gb/s (4x200G PAM4) OSFP224 endpoints, offering extended reach and signal integrity over passive DAC solutions while consuming minimal power (2.5W max).

100% verified on original systems, the MCA7K10-X001 features an Integrated Heat Sink (IHS / Closed Finned Top) connector shell on the 1.6T switch side and two Riding Heat Sink (RHS / Flat Top) connectors on the breakout end. It is specifically optimized for leaf-spine topologies in NVIDIA DGX B300 and GB300 & Rubin NVL72 AI clusters, establishing high-bandwidth, low-latency links between 1.6T switches (such as the Quantum-X800 Q3400-RA) and 800G SuperNICs (including the NVIDIA C8180 ConnectX-8).

Key Features

• 100% Verified Compatibility: Fully compatible with NVIDIA/Mellanox MCA7K10-X001 (980-9IAO5-00X001) for seamless integration into NVIDIA InfiniBand XDR environments.
• 1.6T to 2x800G ACC Breakout Architecture: Converts a 1.6Tb/s (8x200G PAM4) OSFP224 interface into two 800Gb/s (4x200G PAM4) OSFP224 interfaces, maximizing switch port density.
• Tailored for Next-Gen AI Clusters: Purpose-built for deployment in NVIDIA DGX B300, GB300, and Rubin NVL72 cluster architectures connecting leaf switches to compute servers.
• Active Copper Performance & Efficiency: Delivers superior signal integrity with extended reach over passive DACs while keeping power consumption low at only 2.5W.
• Hybrid IHS to RHS Thermal Design: Utilizes a Finned Top (IHS) profile on the switch connector for optimal air cooling and Flat Top (RHS) profiles on the NIC side for tight server enclosure clearance.

Technical Specifications