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NVIDIA/Mellanox Compatible 1.6T DAC OSFP224 IHS/Finned Top to 2x800G OSFP224 RHS/Flat Top InfiniBand XDR Passive Copper Splitter Cable

NVIDIA/Mellanox Compatible 1.6T DAC OSFP224 IHS/Finned Top to 2x800G OSFP224 RHS/Flat Top InfiniBand XDR Passive Copper Splitter Cable

  • Brand: NVIDIA/Mellanox
  • Product Code: O2O224-1.6T-DACH
  • Availability: In Stock
  • $365

Cable Types: O2O224-1.6T-DACH


Brand: NVIDIA/Mellanox (InfiniBand)

Cable : 1m (3ft) NVIDIA/Mellanox Compatible 1.6T DAC OSFP224 IHS/Closed Finned Top 8x200G PAM4 to 2x800G OSFP224 RHS/Flat Top 4x200G PAM4 InfiniBand XDR Passive Direct Attach Copper Splitter Cable for Quantum-X800 Q3400-RA Switch to 2x800G ConnectX-8/9 OSFP SuperNICs (C8180 / C9180)


The NVIDIA/Mellanox compatible 1.6T to 2x800G OSFP224 Passive Direct Attach Copper Splitter Cable (DAC) is an advanced breakout interconnect solution based on cutting-edge 224G SerDes architecture. Designed for high-density, ultra-low latency AI clusters and High-Performance Computing (HPC) networks, the O2O224-1.6T-DACH cable splits a single 1.6Tb/s (8x200G PAM4) twin-port OSFP224 host connection into two independent 800Gb/s (4x200G PAM4) OSFP224 endpoints.

Featuring an Integrated Heat Sink (IHS / Closed Finned Top) connector shell on the 1.6T switch end and two Riding Heat Sink (RHS / Flat Top) connectors on the breakout end, this cable provides optimized thermal management across air-cooled switches and dense server environments. It is purpose-built to connect 1.6T InfiniBand XDR switches—such as the Quantum-X800 Q3400-RA—directly to two 800G SuperNICs, including the NVIDIA ConnectX-8 (C8180) and NVIDIA ConnectX-9 (C9180) platforms.

Key Features

  • 1.6T to 2x800G Breakout Architecture: Converts a single 1.6Tb/s OSFP224 twin-port (8x200G PAM4) into two 800Gb/s OSFP224 ports (4x200G PAM4) for maximum switch port efficiency.
  • 224G SerDes & InfiniBand XDR Performance: Engineered around 224G SerDes technology to deliver high signal integrity and eliminate bandwidth bottlenecks in scale-out AI factories.
  • Hybrid IHS to RHS Thermal Design: Utilizes an IHS (Finned Top) shell on the switch side for maximum heat dissipation and RHS (Flat Top) shells on the NIC side for tight server cage compatibility.
  • Near-Zero Power & Ultra-Low Latency: Energy-efficient passive copper design consumes less than 0.1W while providing zero digital processing latency across short-reach links.
  • Optimized for AI Accelerator Topologies: Perfectly suited for Quantum-X800 Q3400-RA switch-to-SuperNIC connections (NVIDIA C8180 & C9180) and high-density GPU server racks.

Technical Specifications

Form Factor OSFP224 (IHS / Finned Top) to 2x OSFP224 (RHS / Flat Top)
Cable Length & Type 1m (3ft) / Passive Direct Attach Copper (DAC) Splitter
Data Rate / Modulation 1.6Tb/s (8x200G PAM4) to 2x 800Gb/s (4x200G PAM4)
SerDes Architecture 224G SerDes
Wire Gauge (AWG) 26 AWG
Jacket Material PET (Polyethylene Terephthalate)
Power Consumption <0.1W
Minimum Bend Radius 10x Outer Diameter (10xOD)
Commercial Temperature Range 0°C to 70°C (32°F to 158°F)
Protocol Compliance InfiniBand XDR, 1.6T / 800G Ethernet Compliant
Target Applications 1.6T Quantum-X800 Q3400-RA Switch to 2x 800G ConnectX-8 (C8180) / ConnectX-9 (C9180) OSFP SuperNICs

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