NVIDIA/Mellanox Compatible 1.6T DAC OSFP224 RHS/Flat Top 8x200G PAM4 InfiniBand XDR Passive Direct Attach Copper Cable
- Brand: NVIDIA/Mellanox
- Product Code: OSFP-1.6T-CU1FH
- Availability: In Stock
Cable Types: OSFP-1.6T-CU1FH
Brand: NVIDIA/Mellanox (InfiniBand)
Cable : 1m (3ft) NVIDIA/Mellanox Compatible 1.6T DAC OSFP224 RHS/Flat Top 8x200G PAM4 to OSFP224 RHS/Flat Top 8x200G PAM4 InfiniBand XDR Passive Direct Attach Copper Cable for 1.6T RHS NVL5 Switch and ConnectX-8 NICs
The NVIDIA/Mellanox compatible 1.6T OSFP224 RHS/Flat Top Passive Direct Attach Copper Cable (DAC) is a high-performance 1m (3ft) interconnect solution engineered specifically for next-generation InfiniBand XDR and 1.6T Ethernet networking. Supporting 1.6Tb/s (8x200Gb/s PAM4) ultra-high-speed transmission, this passive cable features a Riding Heat Sink (RHS / Flat Top) connector shell design that maximizes thermal efficiency and ensures optimal space compatibility in high-density switch cages and liquid-cooled data center environments.
100% verified and tested on original systems to guarantee seamless compatibility with NVIDIA XDR infrastructure, passive DAC technology delivers near-zero power consumption (<0.1W) and ultra-low latency without digital signal processing delays. Featuring a high-shielded copper structure with ultra-low insertion loss, it provides an ideal, highly reliable interconnect for short-reach, rack-scale deployments such as 1.6T RHS NVL5 switch-to-switch links, 800G ConnectX-8 OSFP SuperNIC connections, and high-density GPU server clusters.
Key Features
- 1.6Tb/s InfiniBand XDR Architecture: Supports 1600Gb/s aggregate throughput using 8x 200G-PAM4 electrical modulation to eliminate bandwidth bottlenecks in modern AI clusters.
- Verified NVIDIA XDR Compatibility: 100% verified on original hardware for seamless integration with NVIDIA InfiniBand XDR networks and NVL5 switches.
- RHS / Flat Top Connector Design: Engineered with a Riding Heat Sink (Flat Top) profile for superior thermal management and high-density rack compatibility.
- Near-Zero Power & Ultra-Low Latency: Features energy-efficient passive copper architecture consuming <0.1W max power with zero signal processing latency.
- Extreme Shielding & EMI Resistance: Constructed with high-shielded 26 AWG copper wires providing maximum crosstalk suppression, low insertion loss, and OSFP MSA compliance.
Technical Specifications
| Form Factor | Twin-port OSFP224 to OSFP224 (RHS / Flat Top) |
| Cable Length & Type | 1m (3ft) / Passive Direct Attach Copper (DAC) |
| Data Rate / Modulation | 1.6Tb/s (2x800Gb/s / 8x 200G-PAM4) |
| Wire Gauge (AWG) | 26 AWG (High-Shielded Copper) |
| Jacket Material | PET (Polyethylene Terephthalate) |
| Power Consumption | <0.1W |
| Minimum Bend Radius | 10x Outer Diameter (10xOD) |
| Commercial Temperature | 0°C to 70°C (32°F to 158°F) |
| Protocol & Compliance | InfiniBand XDR, 1.6T Ethernet Compliant, OSFP MSA |
| Target Applications | 1.6T RHS NVL5 Switch to Switch, 800G ConnectX-8 OSFP NICs, AI/ML GPU Interconnects |



