Cable Types: OSFP-1.6T-AEBH

Brand: NVIDIA/Mellanox (InfiniBand)

Cable : 1.5m (5ft) / 2m (7ft) / 2.5m (8.2ft) / 3m (10ft) NVIDIA/Mellanox Compatible 1.6T AEC OSFP224 IHS/Closed Finned Top 8x200G PAM4 to OSFP224 IHS/Closed Finned Top 8x200G PAM4 InfiniBand XDR Active Electrical Cable for NVIDIA Quantum-X800 Switches (Q3400-RA & Q3200-RA) and NVIDIA DGX B300 / GB300 / Rubin NVL72 AI Clusters

The NVIDIA/Mellanox Compatible 1.6T OSFP224 IHS Active Electrical Cable (AEC) is an advanced, high-performance interconnect solution designed to power short- and medium-reach links in next-generation InfiniBand XDR networks and 1.6T Ethernet AI data centers. Supporting an aggregate bandwidth of 1600Gb/s (8x200Gb/s PAM4) across twin-port OSFP224 interfaces, the OSFP-1.6T-AEBH features an Integrated Heat Sink (IHS / Closed Finned Top) shell design on both ends to deliver maximum thermal performance in dense, air-cooled switch chassis.

Engineered with an integrated state-of-the-art 5nm DSP (retimer) chip, this AEC cable actively retimes electrical PAM4 signals to eliminate signal attenuation and high-frequency loss over extended lengths up to 3 meters. Built using a thin 30 AWG wire design, it drastically reduces rack cable congestion, improves airflow, and enhances bend flexibility (5xOD) compared to thick passive copper cables. 100% verified for NVIDIA XDR ecosystems, it is purpose-built for leaf-to-spine and switch-to-switch interconnects between NVIDIA Quantum-X800 switches (Q3400-RA & Q3200-RA) within NVIDIA DGX B300, GB300, and Rubin NVL72 GPU clusters.

Key Features

• Extended 3m Transmission Range: Overcomes passive copper distance limitations by enabling stable, reliable 1.6Tb/s interconnects up to 3 meters across and between racks.
• Integrated 5nm DSP Retimer: Built-in advanced 5nm DSP active retimers restore signal integrity, achieving ultra-low Bit Error Rates (BER) and eliminating PAM4 signal degradation.
• 30 AWG Thin Cable Architecture: Highly flexible 30 AWG wire design reduces cable bulk and rack congestion while optimizing airflow and thermal dissipation in high-density environments.
• IHS Closed Finned Top Thermal Shells: Features Integrated Heat Sink (IHS) finned-top connectors on both ends for efficient heat removal in high-density switch ports.
• Optimized for AI Scale-Out Networks: Designed for leaf-spine architectures connecting NVIDIA Quantum-X800 switches in NVIDIA DGX B300, GB300, and Rubin NVL72 AI clusters.
• Verified Compatibility & Efficiency: 100% verified on original hardware with power consumption optimized at ≤20W for lower Total Cost of Ownership (TCO).

Technical Specifications