Cable Types: OSFP-1.6T-AE3H

Brand: NVIDIA/Mellanox

Cable : 1.5m (5ft) NVIDIA/Mellanox Compatible 1.6T AEC OSFP224 IHS/Finned Top 8x200G PAM4 to OSFP224 IHS/Finned Top 8x200G PAM4 InfiniBand XDR Active Electrical Cable

Cable : 2m (6.5ft) NVIDIA/Mellanox Compatible 1.6T AEC OSFP224 IHS/Finned Top 8x200G PAM4 to OSFP224 IHS/Finned Top 8x200G PAM4 InfiniBand XDR Active Electrical Cable

Cable : 3m (10ft) NVIDIA/Mellanox Compatible 1.6T AEC OSFP224 IHS/Finned Top 8x200G PAM4 to OSFP224 IHS/Finned Top 8x200G PAM4 InfiniBand XDR Active Electrical Cable

The NVIDIA/Mellanox compatible 1.6T AEC OSFP224 Active Electrical Cable (AEC) is an advanced 1600Gb/s twin-port 2x800Gb/s interconnect solution purpose-built for ultra-high-speed InfiniBand XDR and 1.6T Ethernet networking. Designed with OSFP224 Integrated Heat Sink (IHS / Finned Top) connectors on both ends, this cable features active retimer driver chips built directly into the connector shells to compensate for PAM4 signal attenuation and overcome data loss barriers over high-speed copper links.

Compared to traditional passive copper cables (DAC), the 1.6T OSFP224 AEC active cable extends reliable transmission reach up to 3 meters without sacrificing signal integrity or increasing latency. Designed to meet the demanding thermal and density requirements of modern AI clusters and HPC data center fabrics, this active electrical cable offers a cost-effective, highly configurable, and power-efficient alternative to optical connections for intra-rack and inter-rack switch-to-switch deployments.

Key Features

• 1.6Tb/s Twin-Port Architecture: Delivers high-density 2x800Gb/s performance per connector (8x200G PAM4 electrical modulation) for next-generation InfiniBand XDR fabrics.
• Integrated Active Signal Retimers: Features active components and driver chips to solve PAM4 signal degradation and maintain crystal-clear data transmission.
• Extended Copper Reach (Up to 3m): Achieves longer transmission distances than passive DAC cables while retaining low latency and low power consumption.
• IHS / Finned Top Thermal Design: Built with an OSFP224 Integrated Heat Sink shell for optimal heat dissipation in air-cooled high-density switch chassis.
• Power & Cost Efficient: Offers a low-power (≤20W) alternative to optical transceivers, reducing overall data center operational costs and power budgets.

Technical Specifications